Power amplification system having forward and reverse coupling and digital predistortion compensation

ABSTRACT

Power amplification system having forward and reverse coupling and digital predistortion compensation. In some embodiments, a power amplification system can include a power amplifier configured to receive an input signal and provide an amplified signal, and a coupler implemented relative to an output of the power amplifier and configured to measure forward power and reverse power at the output of the power amplifier. The power amplification system can further include a controller configured to receive information representative of the measured forward power and reverse power, and based on the information, generate a control signal for adjusting a parameter associated with the power amplifier.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Application Nos.63/247,261 filed Sep. 22, 2021, entitled POWER AMPLIFICATION SYSTEMHAVING FORWARD AND REVERSE COUPLING AND DIGITAL PREDISTORTIONCOMPENSATION, 63/247,263 filed Sep. 22, 2021, entitled AMPLIFICATIONSYSTEM HAVING POWER AMPLIFIER MEMORY CORRECTION AND/OR CURRENT COLLAPSECORRECTION, 63/247,267 filed Sep. 22, 2021, entitled DYNAMICOPTIMIZATION OF TRANSISTOR ARRAY IN POWER AMPLIFIER, and 63/247,270filed Sep. 22, 2021, entitled POWER AMPLIFIER HAVING ADAPTIVE ARRAYSIZE, the disclosure of each of which is hereby expressly incorporatedby reference herein in its respective entirety.

BACKGROUND Field

The present disclosure relates to amplifiers for radio-frequencyapplications.

Description of the Related Art

In many radio-frequency (RF) devices, a signal to be transmitted istypically generated by a transceiver. Such a signal it then amplified bya power amplifier; and the amplified signal is routed to an antenna fortransmission.

In the foregoing power amplification, a significant amount of power isutilized to provide desired amplification. Accordingly, it is desirableto have the power amplifier operate efficiently and provide properamplification for the signal.

SUMMARY

In some implementations, the present disclosure relates to a poweramplification system that includes a power amplifier configured toreceive an input signal and provide an amplified signal. The poweramplification system further includes a monitor and adapt systemconfigured to monitor one or more conditions associated with the poweramplifier, and to adapt the power amplifier based on monitoredinformation. The one or more conditions includes forward power andreverse power at an output of the power amplifier, a supply current, aninjection voltage point and temperature associated with the poweramplifier, and sensed information from a plurality of locations of anarray of the power amplifier. The adaptation includes some or all of (1)adjustment of an operating parameter of the power amplifier based on theforward power and reverse power, (2) correction of either or both of amemory effect and a current collapse effect associated with the poweramplifier, (3) generation of a pattern of one or more transistorproperties over the array to allow operation of the array in a desiredmanner based on the pattern, and (4) adjustment of the size of thearray.

In accordance with some implementations, the present disclosure relatesto a power amplification system that includes a power amplifierconfigured to receive an input signal and provide an amplified signal,and a coupler implemented relative to an output of the power amplifierand configured to measure forward power and reverse power at the outputof the power amplifier. The power amplification system further includesa controller configured to receive information representative of themeasured forward power and reverse power, and based on the information,generate a control signal for adjusting a parameter associated with thepower amplifier.

In some embodiments, the control signal can include a signal forproviding digital predistortion to a digital signal corresponding to theinput signal provided to the power amplifier.

In some embodiments, the controller can include either or both of anartificial intelligence capability and a neural network capability. Thecontroller includes a processor configured to provide either or both ofthe artificial intelligence capability and the neural networkcapability.

In some embodiments, both of the processor and the power amplifier canbe implemented within same location or device. In some embodiments, theprocessor and the power amplifier can be implemented at differentlocations or devices.

In some embodiments, the controller can be configured to determine avoltage standing wave ratio based on the measured forward power andreverse power. The control signal can include a signal for adjusting abias being provided to the power amplifier based on the voltage standingwave ratio.

In some embodiments, the power amplifier can include an amplifyingtransistor having a gate, a source, and a drain, such that the gate isan input for receiving the input signal and the drain is connected tothe output of the power amplifier. The control signal can include asignal for adjusting either or both of gate-source voltage and supplyvoltage to compensate for a load mismatch based on the voltage standingwave ratio. In some embodiments, the amplifying transistor can beimplemented as a gallium nitride (GaN) transistor.

In some embodiments, the coupler can be configured to include four portscorresponding to a first port coupled to the output of the poweramplifier, a second port coupled to an antenna node, a third port forforward power measurement, and a fourth port for reverse powermeasurement. The third port and the fourth port can be coupled to or becapable of being coupled to the controller.

According to some teachings, the present disclosure relates to a methodfor operating a power amplification system. The method includesproviding an input signal to a power amplifier and amplifying the inputsignal with the power amplifier to generate an amplified signal. Themethod further includes measuring forward power and reverse power at anoutput of the power amplifier, and generating a control signal based onthe measured forward power and reverse power for adjusting a parameterassociated with the power amplifier.

In some embodiments, the method can further include performing a digitalpredistortion operation to a digital signal corresponding to the inputsignal provided to the power amplifier based on the control signal.

In some embodiments, the generating of the control signal can includeeither or both of an artificial intelligence operation and a neuralnetwork operation. The generating of the control signal can includedetermining a voltage standing wave ratio based on the measured forwardpower and reverse power. The generating of the control signal caninclude providing a signal for adjusting a bias being provided to thepower amplifier based on the voltage standing wave ratio. The generatingof the control signal can include providing a signal for adjustingeither or both of gate-source voltage and supply voltage to compensatefor a load mismatch based on the voltage standing wave ratio.

In some implementations, the present disclosure relates to a wirelesssystem that includes a baseband sub-system configured to process adigital signal to be transmitted, a power amplifier configured toreceive an analog signal representative of the digital signal andprovide an amplified signal, and an antenna in communication with anoutput of the power amplifier and configured to support transmission ofthe amplified signal. The wireless system further includes a monitor andadapt system implemented to measure forward power and reverse power atthe output of the power amplifier, and to generate a control signal foradjusting a parameter associated with the power amplifier based on themeasured forward power and reverse power.

In some embodiments, the wireless system can be implemented in a basestation. In some embodiments, the base station can include a cellularbase station functionality.

In some embodiments, the wireless system can be implemented in a mobiledevice. In some embodiments, the mobile device can include a cellularfunctionality.

According a number of teachings, the present disclosure relates to apower amplification system that includes a power amplifier including anamplifying transistor configured to receive an input signal and providean amplified signal, and a monitoring system configured to monitor oneor more of a supply current for the amplifying transistor, an injectionvoltage point of the amplifying transistor, forward power at an outputof the amplifying transistor, and temperature of the amplifyingtransistor. The power amplification system further includes a controlsystem configured to obtain monitored information, and based on theinformation, generate a control signal for correcting either or both ofa memory effect of the amplifying transistor and a current collapseeffect of the amplifying transistor.

In some embodiments, the control signal can further include a signal forproviding digital predistortion to a digital signal corresponding to theinput signal provided to the power amplifier.

In some embodiments, the controller can include either or both of anartificial intelligence capability and a neural network capability. Thecontroller can include a processor configured to provide either or bothof the artificial intelligence capability and the neural networkcapability.

In some embodiments, both of the processor and the power amplifier canbe implemented within same location or device. In some embodiments, theprocessor and the power amplifier can be implemented at differentlocations or devices.

In some embodiments, the controller can be configured to generate awarning flag to a system above the power amplification system.

In some embodiments, the control signal can include a signal foradjusting an injection voltage of the amplifying transistor. In someembodiments, the amplifying transistor can include a gate, a source, anda drain, such that the gate is an input for receiving the input signaland the drain is connected to the output of the power amplifier. In someembodiments, the injection voltage can include a gate-source voltage. Insome embodiments, the amplifying transistor can be implemented as agallium nitride (GaN) transistor.

In some teachings, the present disclosure relates to a method foroperating a power amplification system. The method includes providing aninput signal to an amplifying transistor of a power amplifier,amplifying the input signal with the amplifying transistor to generatean amplified signal, and monitoring one or more of a supply current forthe amplifying transistor, an injection voltage point of the amplifyingtransistor, forward power at an output of the amplifying transistor, andtemperature of the amplifying transistor. The method further includesgenerating a control signal based on monitored information forcorrecting either or both of a memory effect of the amplifyingtransistor and a current collapse effect of the amplifying transistor.

In some embodiments, the method can further include performing a digitalpredistortion operation to a digital signal corresponding to the inputsignal provided to the power amplifier based on the control signal.

In some embodiments, the generating of the control signal can includeeither or both of an artificial intelligence operation and a neuralnetwork operation. The generating of the control signal can includeproviding a warning flag to a system above the power amplificationsystem.

In some embodiments, the generating of the control signal can includeproviding a signal for adjusting an injection voltage of the amplifyingtransistor. The injection voltage can include a gate-source voltage.

In some implementations, the present disclosure relates to a wirelesssystem that includes a baseband sub-system configured to process adigital signal to be transmitted, a power amplifier configured toreceive an analog signal representative of the digital signal andprovide an amplified signal, and an antenna in communication with anoutput of the power amplifier and configured to support transmission ofthe amplified signal. The wireless system further includes a monitor andadapt system implemented to monitor one or more of a supply current forthe amplifying transistor, an injection voltage point of the amplifyingtransistor, forward power at an output of the amplifying transistor, andtemperature of the amplifying transistor. The monitor and adapt systemis further configured to obtain monitored information, and based on theinformation, generate a control signal for correcting either or both ofa memory effect of the amplifying transistor and a current collapseeffect of the amplifying transistor.

In some embodiments, the wireless system can be implemented in a basestation. In some embodiments, the base station can include a cellularbase station functionality.

In some embodiments, the wireless system can be implemented in a mobiledevice. In some embodiments, the mobile device can include a cellularfunctionality.

According to a number of implementations, the present disclosure relatesto a power amplification system that includes a power amplifierincluding an array of transistors, with the array being configured toreceive an input signal and provide an amplified signal. The poweramplification system further includes a monitoring system including aplurality of sensing circuits implemented at respective locations of thearray. The power amplification system further includes a control systemconfigured to obtain sensed information from the plurality of sensingcircuits, and based on the information, generate a pattern of one ormore transistor properties over the array to allow operation of thearray in a desired manner based on the pattern.

In some embodiments, the control signal can further include a signal forproviding digital predistortion to a digital signal corresponding to theinput signal provided to the power amplifier.

In some embodiments, the controller can include either or both of anartificial intelligence capability and a neural network capability. Thecontroller can include a processor configured to provide either or bothof the artificial intelligence capability and the neural networkcapability.

In some embodiments, both of the processor and the power amplifier canbe implemented within same location or device. In some embodiments, theprocessor and the power amplifier can be implemented at differentlocations or devices.

In some embodiments, the pattern generated by the controller can includea predictive pattern.

In some embodiments, the plurality of sensing circuits can be configuredsuch that the monitored information includes some or all of temperature,gain and bias condition of respective transistors in the array. In someembodiments, the transistors can be implemented as gallium nitride (GaN)transistors having memory properties. In some embodiments, thecontroller can be configured such that the pattern generated by thecontroller includes a statistical analysis of some or all of themonitored information.

In some implementations, the present disclosure relates to a method foroperating a power amplification system. The method includes providing aninput signal to an array of transistors of a power amplifier, andamplifying the input signal with the array to generate an amplifiedsignal. The method further includes sensing one or more conditionsassociated with the transistors at a plurality of locations of thearray, and generating a pattern of one or more transistor propertiesbased on information from the sensing to allow operation of the array ina desired manner based on the pattern.

In some embodiments, the method can further include performing a digitalpredistortion operation to a digital signal corresponding to the inputsignal provided to the power amplifier based on the pattern.

In some embodiments, the generating of the pattern can include either orboth of an artificial intelligence operation and a neural networkoperation. In some embodiments, the generating of the pattern caninclude a predictive pattern operation.

In some embodiments, the sensing of the one or more conditions caninclude sensing of some or all of temperature, gain and bias conditionof respective transistors in the array.

In some implementations, the present disclosure relates to a wirelesssystem that includes a baseband sub-system, a power amplifier configuredto receive an analog signal representative of the digital signal andprovide an amplified signal, the power amplifier including an array oftransistors, and an antenna in communication with an output of the poweramplifier and configured to support transmission of the amplifiedsignal. The wireless system further includes a monitor and adapt systemincluding a plurality of sensing circuits implemented at respectivelocations of the array, and a control system configured to obtain sensedinformation from the plurality of sensing circuits, and based on theinformation, generate a pattern of one or more transistor propertiesover the array to allow operation of the array in a desired manner basedon the pattern.

In some embodiments, the wireless system can be implemented in a basestation. In some embodiments, the base station can include a cellularbase station functionality.

In some embodiments, the wireless system can be implemented in a mobiledevice. In some embodiments, the mobile device can include a cellularfunctionality.

In accordance with some implementations, the present disclosure relatesto a power amplification system that includes a power amplifierincluding a variable size array of transistors, and a monitoring systemconfigured to monitor one or more conditions associated with the poweramplifier. The power amplification system further includes a controlsystem configured to obtain monitored information from the monitoringsystem, and based on the information, generate a control signal toadjust the size of the array of transistors.

In some embodiments, the control signal can further include a signal forproviding digital predistortion to a digital signal corresponding to theinput signal provided to the power amplifier.

In some embodiments, the controller can further include either or bothof an artificial intelligence capability and a neural networkcapability. The controller can include a processor configured to provideeither or both of the artificial intelligence capability and the neuralnetwork capability.

In some embodiments, both of the processor and the power amplifier canbe implemented within same location or device. In some embodiments, theprocessor and the power amplifier can be implemented at differentlocations or devices.

In some embodiments, the array of transistors can be arranged in aplurality of sections, such that the size of the array is implemented byuse of some or all of the sections of transistors.

In some embodiments, the monitored information can include some or allof average power, frequency, supply voltage, temperature and mismatchcondition associated with the power amplifier.

In some embodiments, the control signal can be configured to allowadjustment of the array of transistors based on one or more of operatingconditions including lower duty cycle, lower average power and lowertemperature.

In some embodiments, the controller can be configured to includelearning capability to allow the adjustment of the size of the array oftransistors to be at least quasi-seamless.

In some embodiments, array of transistors can be implemented as an arrayof gallium nitride (GaN) transistors.

According to some teachings, the present disclosure relates to a methodfor operating a power amplification system. The method includesproviding an input signal to variable size array of transistors of apower amplifier, and amplifying the input signal with the array togenerate an amplified signal. The method further includes monitoring oneor more conditions associated with the power amplifier, and generating acontrol signal to adjust the size of the array on the monitoring.

In some embodiments, the method can further include performing a digitalpredistortion operation to a digital signal corresponding to the inputsignal provided to the power amplifier based on the control signal.

In some embodiments, either or both of the monitoring and the generatingcan include some or all of an artificial intelligence operation, aneural network operation, and a learning operation.

In some embodiments, the monitoring can include monitoring some or allof average power, frequency, supply voltage, temperature and mismatchcondition associated with the power amplifier.

In some embodiments, the generating of the control signal can includeconfiguring the control signal to allow adjustment of the array oftransistors based on one or more of operating conditions including lowerduty cycle, lower average power and lower temperature.

In some implementations, the present disclosure relates to a wirelesssystem that includes a baseband sub-system, a power amplifier configuredto receive an analog signal representative of the digital signal andprovide an amplified signal, the power amplifier including a variablesize array of transistors, and an antenna in communication with anoutput of the power amplifier and configured to support transmission ofthe amplified signal. The wireless system further includes a monitor andadapt system configured to monitor one or more conditions associatedwith the power amplifier, and a control system configured to obtainmonitored information from the monitoring system, and based on theinformation, generate a control signal to adjust the size of the arrayof transistors.

In some embodiments, the wireless system can be implemented in a basestation. In some embodiments, the base station can include a cellularbase station functionality.

In some embodiments, the wireless system can be implemented in a mobiledevice. In some embodiments, the mobile device can include a cellularfunctionality.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

The present disclosure relates to U.S. patent application Ser. No.______ [Attorney Docket 75900-50514US], entitled AMPLIFICATION SYSTEMHAVING POWER AMPLIFIER MEMORY CORRECTION AND/OR CURRENT COLLAPSECORRECTION, U.S. patent application Ser. No. ______ [Attorney Docket75900-50515US], entitled DYNAMIC OPTIMIZATION OF TRANSISTOR ARRAY INPOWER AMPLIFIER, and U.S. patent application Ser. No. ______ [AttorneyDocket 75900-50516US], entitled POWER AMPLIFIER HAVING ADAPTIVE ARRAYSIZE, the disclosure of each of which is filed on even date herewith andhereby incorporated by reference herein in its entirety.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a power amplification system that includes a poweramplifier for amplifying a radio-frequency (RF) signal received as aninput to provide an amplified RF signal as an output.

FIG. 2 shows a process that can be implemented with the poweramplification system of FIG. 1 .

FIG. 3 shows a power amplification system that can be a more specificexample of the power amplification system of FIG. 1 .

FIG. 4 shows a process that can be implemented with the poweramplification system of FIG. 3 .

FIG. 5 shows an example of a power amplification system that utilizes acontroller that obtains only a forward power information from an RFcoupler 14.

FIG. 6 shows that in some embodiments, a power amplification system caninclude a power amplifier that provides an amplified signal to an outputsignal path, and a power coupler for obtaining both forward power andreverse power information.

FIG. 7 shows a typical current collapse seen in some high-power poweramplifiers due to trapping effects in semiconductor layers.

FIG. 8 shows that in some embodiments, a power amplification system caninclude one or more features configured to detect and correct at leastsome of the effect of FIG. 7 .

FIG. 9 shows that in some embodiments, a power amplification system canbe configured to dynamically provide optimized or desired bias controlfor a transistor array of a power amplifier while the array is in use.

FIG. 10 shows that in some embodiments, local sensors and local biascontrols for the respective RF transistors can be configured to allowsensing and control over thermal gradients associated with a poweramplifier.

FIG. 11 shows that in some embodiments, for the example of FIG. 10 , anRF transistor can have a matched element in the array that can beswitched to measure its bias condition.

FIG. 12 shows that in some embodiments, a power amplifier of a poweramplification system can include an RF transistor array having aplurality of sections, with at least some of the sections beingswitchable sections.

FIG. 13 shows an example of the switchable sections of FIG. 12 .

FIGS. 14A to 14D show that in some embodiments, a power amplificationsystem can include features associated with one of the four exampleembodiments described herein.

FIGS. 15A to 15F show that in some embodiments, a power amplificationsystem can include features associated with two of the four exampleembodiments described herein.

FIGS. 16A to 16D show that in some embodiments, a power amplificationsystem can include features associated with three of the four exampleembodiments described herein.

FIG. 17 show that in some embodiments, a power amplification system caninclude features associated with all of the four example embodimentsdescribed herein.

FIG. 18 shows that in some embodiments, a semiconductor die can includea power amplification system having a power amplifier and a monitor andadapt system having one or more features as described herein.

FIG. 19 shows that in some embodiments, a semiconductor die can includea power amplifier of a power amplification system, and at least some ofa monitor and adapt system can be implemented outside of thesemiconductor die.

FIG. 20 shows that in some embodiments, an RF module can include a poweramplification system 100 having one or more features as describedherein.

FIG. 21 shows that in some embodiments, an RF module can include a firstdie having a power amplifier, a second die having a monitor circuit, anda third die having a digital predistortion system.

FIG. 22 shows that in some embodiments, an RF module can include a firstdie having a power amplifier, and a second die having a monitor circuit.

FIG. 23 shows a block diagram of a wireless system that includes a poweramplification system having one or more features as described herein.

FIG. 24 shows that in some embodiments, substantially all of thewireless system of FIG. 23 can be implemented within a base station suchas a cellular base station.

FIG. 25 shows that in some embodiments, substantially all of thewireless system of FIG. 23 can be implemented within a mobile device.

FIG. 26 shows that in some embodiments, a portion of the wireless systemof FIG. 23 can be implemented within a base station such as a cellularbase station, and another portion of the wireless system can beimplemented away from the base station.

FIG. 27 shows that in some embodiments, a portion of the wireless systemof FIG. 23 can be implemented within a mobile device, and anotherportion of the wireless system can be implemented away from the mobiledevice.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

FIG. 1 depicts a power amplification system 100 that includes a poweramplifier (PA) 102 for amplifying a radio-frequency (RF) signal receivedas an input (RF_in) to provide an amplified RF signal as an output(RF_out). Such an amplified RF signal is shown to be routed to anantenna 104 for transmission. For the purpose of description, an RFsignal may also be referred to as a signal.

In FIG. 1 , the power amplification system 100 is shown to furtherinclude a system 110 configured to monitor one or more parametersassociated with operation of the power amplifier 102, and based on suchmonitored parameter(s), adapt one or more features associated with thepower amplifier 102. Examples of such monitored parameter(s) andfeature(s) associated with the power amplifier 102 are described hereinin greater detail. While such examples are described in the context ofpower amplifiers, it will be understood that one or more features of thepresent disclosure can also be implemented in other types of amplifiers,including other types of RF amplifiers.

FIG. 2 shows a process 120 that can be implemented with the poweramplification system 100 of FIG. 1 . In block 122, one or moreconditions associated with a power amplifier can be obtained. In block124, an operating configuration of the power amplifier can be adjustedbased on the one or more conditions. In some embodiments, such adjustingof the operating configuration of the power amplifier can includedigitally adjusting an operating configuration of the power amplifier.Examples of such digital adjustment are described herein in greaterdetail.

FIG. 3 shows a power amplification system 100 that can be a morespecific example of the power amplification system 100 of FIG. 1 . FIG.3 shows that in some embodiments, the power amplification system 100 caninclude a system 110 having a monitor 112 and a digital predistortion(DPD) system 114. The monitor 112 can be configured to obtain one ormore conditions associated with a power amplifier 102, and the DPDsystem 114 can be configured to digitally adapt one or more featuresassociated with the power amplifier 102.

FIG. 4 shows a process 130 that can be implemented with the poweramplification system 100 of FIG. 3 . In block 132, one or moreconditions associated with a power amplifier can be obtained. In block134, a DPD operation for the power amplifier can be performed based onthe one or more conditions.

Example 1

In many radio-frequency (RF) applications, power amplifiers (PAs) areimplemented with more non-linear designs, but with higher efficiency. Insuch designs, overall transmit (Tx) system linearity can be maintainedwith use of a baseband digital signal processing (DSP) controller toprovide digital pre-distortion (DPD) for a signal that will eventuallybe amplified by a power amplifier.

FIG. 5 shows an example of a power amplification system that utilizesthe foregoing design. More particularly, in the example of FIG. 5 , aDPD controller 16 obtains only a forward power (P_fwd) information, froman RF coupler 14, of an amplified signal output from a power amplifier12. Such power amplifier and RF coupler are typically implemented on apower amplifier module (PAM) or a front-end module (FEM) 10.

Based on the observed forward power information such as signal amplitudeand phase information, the DPD controller 16 can be utilized to estimateand correct any non-linearities associated with the power amplifier 12.Such a correction typically includes digital pre-distortion to I/Qsignals.

FIG. 6 shows that in some embodiments, a power amplification system 100can include a power amplifier 102 configured to amplify an input signal(RF In) and generate an amplified signal that is routed to an antennafor transmission through an output signal path. In such an output signalpath between the power amplifier 102 and the antenna, there is forwardpower (P_fwd) associated with forward-direction signal(s) (RF_fwd)(including the amplified signal being routed to the antenna), andreverse power (P_rev) associated with reverse-direction signal(s)(RF_rev) (including, for example, a reflected signal from the antennaand a received signal from the antenna).

In the example of FIG. 6 , an RF coupler 140 is shown to be implementedalong the signal path between the power amplifier 102 and the antenna.In some embodiments, information for both of the forward power (P_fwd)and reverse power (P_rev) can be obtained utilizing the RF coupler 140.Such information can be provided to a controller 114, and the controller114 can generate one or more control signals to adjust an operationinvolving the power amplifier 102. Such an adjustment can include, forexample, some or all of digital pre-distortion to I/Q signals andadjustments to various voltages (e.g., Vgs, Vs, Vd, etc.) associatedwith an amplifying transistor of the power amplifier 102. It is notedthat in some embodiments, the adjustments to the various voltages do notnecessarily need to be performed along with the digital pre-distortionoperation.

In some embodiments, both of the measured forward and reverse powers(P_fwd, P_rev) can be used by the controller 114 that includes and/orutilizes artificial intelligence (AI) and/or neural network adaptivealgorithms that provide some or all of the following functionalities.For example, DPD corrections can be applied to I/Q signals. In anotherexample, the controller can learn how the PA 102 is corrupted ordegraded based on the received forward and reverse power information. Inyet another example, a neural network can be utilized to allow thecontroller to be taught to autonomously correct power amplifier relatedparameters such as load impedances (VSWR) and process drift which canoccur over time.

In the example of FIG. 6 , the controller 114 is depicted as a basebandcontroller system (BBCS). In some embodiments, such a controller systemcan be coupled to a forward and reverse power coupler (FRPC) 140. Themeasured power information (P_fwd, P_rev) from the FRPC 140 can bepassed to a DPD controller with learning or learning-like capabilitiessuch as artificial intelligence (AI) and/or neural network (NN) to, forexample, determine levels of forward and reverse RF signal strengths andto independently correct for any detected signal errors.

In some embodiments, knowledge of forward and reverse signal strengthscan be used by a baseband controller to detect and correct for anydegradations of the power amplifier 102 (e.g., gain drop, currentfluctuations, semiconductor degradations, etc.) that can affect thepower amplifier's output power level.

In some embodiments, knowledge of the forward and reverse signalstrengths can be utilized by the BBCS 114 to determine the VSWR seen bythe power amplifier 102. The BBCS can then adjust bias currents and/orsupply voltages for the power amplifier 102 to compensate for increasedor decreased VSWR levels. It is noted that if an impedance tuner ispresent between the antenna and the power amplifier output, the tunercan be adjusted synchronously with DPD coefficients, and a neuralnetwork is preferable for learning a desired correction based oninformation obtained from the coupler. For example, a tilt on reflectedpower versus frequency can indicate which way the tuner should beadjusted, rather than pursuing a blind tuning approach.

Referring to FIG. 6 , it is also noted that in some embodiments, a poweramplifier module (PAM) 101 can be configured such that the RF coupler140 includes four ports to provide the above-described measurements andutilization of the forward and reverse power information (P_fwd, P_rev).As described herein, such information can be processed with a DPDcontroller and neutral network (NN) to monitor forward and reverse power(P_fwd and P_rev), to determine VSWR seen by the power amplifier 102.The neural network can then be utilized to make adjustments to poweramplifier bias, Vgs and Vdd to compensate for any load mismatch that maybe present (e.g., in 5G mMIMO cellular systems).

It is also noted that with one or more features of the presentdisclosure, any slow RF degradation (e.g., monitored from the forwardsignal, under low VSWR condition) can be corrected by the neural networkby using a combination of input signals such as gate currents, biasvoltages, drain voltages, etc.

It is also noted that the power amplifier module monitoring as describedherein can result in a power amplifier to be more robust against reverseinter-modulation distortion, and be less susceptible to externalblockers. It is noted that when such an external blocker is present atthe antenna, its power will be significantly stronger when measured onthe reverse side of the directional coupler than on the forward side.The difference in power depends on the coupler directivity as well as onthe power amplifier output impedance. In practical designs, when anexternal signal is injected into the antenna, it typically appears 10times stronger on the reverse side of the coupler than on the forwardside, thereby allowing it to be detected and possibly compensated for.

In the example of FIG. 6 , a monitor system 112 (112 in FIG. 3 ) can beconsidered to include the forward and reverse power coupler (FRPC) 140,and a DPD system 114 (114 in FIG. 3 ) can be considered to include theBBCS 114. Thus, in some embodiments, a monitor and adapt system for theexample of FIG. 6 is indicated as 110, and also as 1000 a.

Example 2

In many radio-frequency (RF) applications, such as in cellular basestations, power amplification demands higher peak powers with higherefficiency. Power amplifiers (PAs) built with higher peak powertypically need to handle high junction temperatures. At high junctiontemperatures and high output power, semiconductor materials tend toexperience electron trapping effects, which can lead to current collapseand distorted RF signal output.

Described herein are examples of how some or all of such problems can beaddressed by a power amplification system having a monitor and adaptsystem such as the examples of FIGS. 1 and 3 .

FIG. 7 shows a typical current collapse seen in high power galliumnitride (GaN) power amplifiers due to trapping effects in semiconductorlayers. It is noted that power amplifier semiconductor materials canexhibit a phenomena referred to as current collapse, where Delta(Vgs,Vdd) is a measure of how much the current is reduced from a nominalun-stressed CW condition. The amount of such Delta(Vgs, Vdd) isprimarily related to gate voltage (Vgs), operational drain voltage(Vdd_opt), signal pulse width (PW), pulse duty cycle, output RF power,and temperature.

FIG. 8 shows that in some embodiments, a power amplification system 100can include a power amplifier 102 configured to amplify an input signal(RF In) and generate an amplified signal that is routed to an antennafor transmission through an output signal path. In such an output signalpath between the power amplifier 102 and the antenna, there is forwardpower (P_fwd) associated with forward-direction signal(s) (RF_fwd)(including the amplified signal being routed to the antenna.

In the example of FIG. 8 , an RF coupler 150 is shown to be implementedalong the signal path between the power amplifier 102 and the antenna.In some embodiments, information for the forward power (P_fwd) can beobtained utilizing the RF coupler 150. Such information can be providedto a controller 114, and the controller 114 can generate one or morecontrol signals to adjust an operation involving the power amplifier102.

In some embodiments, the power amplification system 100 of FIG. 8 can beconfigured to detect and correct for power amplifier memory and currentcollapse effects, such as the effects of FIG. 7 .

In the power amplification system 100 of FIG. 8 , monitored parametersassociated with the power amplifier 102 can include some or all of Iddcurrents, a Vgs injection point, a sample of RF signal (via the RFcoupler 150), and a sensed temperature. Such monitored parameters can beprovided to an observation receiver 114 having a controller with neutralnetwork (NN) capabilities, which can be used to monitor Idd at givenVdd, and determine if the monitored current level is within anacceptable range, for a given RF output power and temperature normal.

In some embodiments, the neutral network associated with the observationreceiver 114 can be “trained” to apply a desired Vgs when anunacceptable current collapse is detected on Vdd supply. In someembodiments, depending on some or all of measured Idd current collapse,Delta(Vgs, Vds), pulse width, duty cycle, desired Pout and presenttemperature, the neural network can set a warning flag for the poweramplification system 100, and/or try to compensate for the currentcollapse by adjusting Vgs.

It is noted that the power amplification system 100 of FIG. 8 can beconfigured to not only correct for I/Q signal distortions introduced bythe power amplifier, but also correct for memory and current collapseeffects of the power amplifier 102. It is also noted that the poweramplification system 100 of FIG. 8 can also be configured to calibratethe power amplifier 102 to update the memory effects as temperature,signal pulse width and duty cycle change. Such calibration can also beutilized to track and correct for power amplifier aging effects.

In the example of FIG. 8 , a monitor system 112 (112 in FIG. 3 ) can beconsidered to include monitoring of power of the RF signal output fromthe power amplifier 102 (e.g., by the coupler 150), monitoring of theIdd current, and monitoring of the present temperature. A DPD system 114(114 in FIG. 3 ) can be considered to include the observation receiver114. Thus, in some embodiments, a monitor and adapt system for theexample of FIG. 8 is indicated as 110, and also as 1000 b.

Example 3

FIG. 9 shows that in some embodiments, a power amplification system 100can be configured to dynamically provide optimized or desired biascontrol for a transistor array of a power amplifier 102 while the arrayis in use. In some embodiments, such a power amplification system can beutilized inside a system such as a cellular base-station, based on aplurality of sensors (e.g., temperature and/or gain sensors) and controlpoints (e.g., bias control points).

It is noted that some types of RF transistors have short and long termmemory effects. By dispersing sensor devices across the array, apredictive algorithm can be run in a controller such as a neural networkto adjust both DPD and local bias. For time division duplex (TDD)systems, DPD parameters can be set based on the sensors before an RFtransmission is started, thus considerably speeding up the convergenceof the DPD system. It is noted that an advantage of a distributedsensing system can reveal statistical changes in the array thatsingle-sensor solutions cannot.

It is noted that some designs often utilize one temperature sensorsystem and do not allow for directed controls inside an array. Whilesuch a single sensor provides information that could be used to improvesaturation power and avoid a pinching in one area of the array, it doesnot provide any information effects such as propagation of thermalgradients thru the array.

FIG. 9 shows that in some embodiments, a plurality of circuits (e.g.,162 a, 162 b, 162 c) configured as sensors can be embedded within the RFpower transistor array of the power amplifier 102. Such sensor circuitscan provide sensed information to a DPD engine 114, through a monitoringsystem 160, of effects such as evolution of thermal transients thru thepower amplifier 102.

The foregoing sensed information can be utilized to, for example,optimize starting coefficients for DPD based on recognizing certainstates, or more preferably, certain patterns of behavior. For example,suppose that the power amplifier 102 heats up in response to a powerincrease. Since the array of the power amplifier 102 typically does notheat up uniformly, it is expected that during the heating transition thedevice characteristics will change. Thus, the series of sensors (e.g.,162 a, 162 b, 162 c) can be utilized to evaluate time constant(s)associated with the change.

If the RF transistor devices are arranged in a way such that theyreceive the same bias, behavior of trap charges is also likely to matchthat of an active RF transistor. Such a property can be learned by aneural network and used to adjust the DPD following a learned pattern.

It is noted that by utilizing the plurality of sensor circuits and theforegoing pattern learning functionality, device failures due toover-crowding in the array could be prevented, since there is amechanism to monitor multiple locations inside the packaged device for afast temperature rise. Such a failure-prevention functionality can beparticularly beneficial for power amplifiers having a large array.

It is noted that in transistors such as gallium nitride (GaN)transistors, memory is a known issue and depends on the prior conditionof use of the transistor. Such memory can be detected by measuring thebias, and remains a statistical phenomena. Thus, by submitting a numberof transistors to same conditions (e.g., temperature, bias, power), onecan expect to have detectable bias variations. Since this is astatistical change, a sample size larger than one can be obtained, andsuch a sample size can be accommodated by the plurality of sensorcircuits (e.g., 162 a, 162 b, 162 c in FIG. 9 ) to evaluate the state ofa large array.

In some embodiments, a change in DC bias can be monitored; but while itcorrelates to RF performance, the RF performance typically does notchange in a linear relation to the bias change. Thus, such monitoring ofDC bias change can be implemented with a learning system that canprocess multivariable non-linear functions, with a neural engine beingone example.

It is noted that since all the transistors in an array are not subjectedto the same temperature and RF power, differences across the array willlikely be present. Adjusting bias to individual sections of the arraycan be achieved, as well a good prediction of the whole arrayperformance, based on, for example, the worst transistor in the array.Thus, the use of a plurality of sensor circuits and control is shown tobe desirable for digital pre-distortion with training influenced by thesensors.

FIG. 10 shows that in some embodiments, local sensors (e.g., 162 a, 162b, 162 c) and local bias controls (e.g., 164 a, 164 b, 164 c) for therespective RF transistors (e.g., 102 a, 102 b, 102 c) can be configuredto allow sensing and control over thermal gradients associated with apower amplifier 102. In FIG. 10 , the power amplification system 100 issimilar to the example of FIG. 9 ; however, a control system 166 isshown to provide control for the local bias control circuits (e.g., 164a, 164 b, 164 c).

In some embodiments, predictive information can be gathered to optimizethe array, even after manufacturing. System optimization can rely on anexternal fast reacting and anticipating multi-variable optimizerinstantiated with the digital pre-distortion system 114.

FIG. 11 shows that in some embodiments, for the example of FIG. 10 , anRF transistor 102 can have a matched element 162 in the array that canbe switched (e.g., by 161) to measure its bias condition. Such animplementation has a benefit of operating the sensing transistor in verynear identical conditions as the main active RF transistors near it.

Accordingly, a desired RF power density can be achieved, allowing thepower amplifier to have the same statistical memory (e.g., trapping)affecting the sensing device 162 as the main active device 102.

In some embodiments, the foregoing sensing device 162 can be utilizedduring transmission gaps. In some embodiments, the sensing device 162can be utilized carefully during a continuous transmission if themonitoring transistor is sufficiently small. In some embodiments,sensing can be synchronized to the less sensitive portions of the RFframes.

In the example of FIGS. 9-11 , a monitor system 112 (112 in FIG. 3 ) canbe considered to include the plurality of sensors (e.g., 162 a, 162 b,162 c) associated with the power amplifier 102, and the monitoringsystem 160. A DPD system 114 (114 in FIG. 3 ) can be considered toinclude the DPD engine 114. Thus, in some embodiments, a monitor andadapt system for the example of FIGS. 9-11 is indicated as 110, and alsoas 1000 c.

Example 4

With advances in DPD algorithms, it is becoming easier to adjust a poweramplification system based on variable conditions of operation of an RFpower amplifier. For example, average power, frequency, supply voltage,bandwidth temperature and mismatch are conditions associated with suchan RF power amplifier. Based on one or more of such conditions, suitableRF performance can be maintained. However, a limitation arises from thenumber of calibration points needed for the DPD system.

In some embodiments, sufficient computing power, with or withoutcloud-based computing, can be utilized to alleviate these constraints,thereby allowing finer optimization of the RF power amplifier'stransistor array size.

In some embodiments, transistor size array can be optimized dynamically,and be fine-tuned for performance of an RF power transistor array. It isnoted that transistor array size is typically the first determinant ofpower amplifier performance. However, a compromise between performanceand reliability (e.g., selected for worst case conditions) is typicallymade in RF power transistor arrays.

If one allows implementation of a significantly variable array size, atransistor's periphery can be adjusted to conditions similar to when thetransistor is being used. For example, such conditions can include lowerduty cycle, lower average power or lower temperature than the maximumoperating conditions.

In some embodiments, an optimizer can be implemented to include a DPDsystem capable of learning the characteristics of a power amplifier inits various states so that quasi-seamless transitions can be achieved.

It is noted that in some implementations, transistor array size isfixed, or it is adjusted mostly as a state dependent on the averagepower level. It is also noted that if such adjustment in made, thetransistor size is typically changed during non-transmitting phases ofcommunication.

FIG. 12 shows that in some embodiments, a power amplifier 102 of a poweramplification system 100 can include an RF transistor array having aplurality of sections (102 a, 102 b). Such sections can allow differentsizes to be implemented as the RF transistor array.

In some embodiments, a DPD system including a DPD engine 114 can beconfigured to learn DPD parameters based on each configuration that hasassociated with it a different array(s) being used.

In the example of FIG. 12 , a control system 170 can be configured toallow switching between the various configurations, based on estimatedneeds and previous usage data such as average power and other parameters(e.g., temperature). In some embodiments, the DPD engine 114 can beconfigured to be capable of synchronously changing its parameters tomake the transition quasi-seamless.

In some embodiments, the example RF transistor array 102 of FIG. 12 canbe segmented into multiple switchable sections, using RF switches orcascode controls. An example of such switchable sections is shown inFIG. 13 , where a bias control (176) can be adjusted in combination withthe change in the number of active sections. In FIG. 13 , the switchablesections are indicated as 102 a, 102 b, the RF switches or cascodecontrols are indicated as 174 a, 174 b; and control of the RF switchesor cascode controls can be provided by respective controllers 172 a, 172b.

In some embodiments, the foregoing adjustment to the number of activesections can be achieved during transmission gaps. Alternatively,similar adjustment can be achieved appropriately during a continuoustransmission if the monitoring transistor is sufficiently small. In someembodiments, switching can be synchronized to the less sensitiveportions of the RF frames.

In the example of FIGS. 12 and 13 , a monitor system 112 (112 in FIG. 3) can be considered to include the control system 170. A DPD system 114(114 in FIG. 3 ) can be considered to include the DPD engine 114. Thus,in some embodiments, a monitor and adapt system for the example of FIGS.12 and 13 is indicated as 110, and also as 1000 d.

Examples of Combinations of Features:

In some embodiments, a power amplification system can include featuresassociated with one or more of the four example embodiments describedherein. As described above, FIG. 6 relates to the first exampleembodiment of a power amplification system 100 having a monitor andadapt system 1000 a; FIG. 8 relates to the second example embodiment ofa power amplification system 100 having a monitor and adapt system 1000b; FIG. 9 relates to the third example embodiment of a poweramplification system 100 having a monitor and adapt system 1000 c; andFIG. 12 relates to the fourth example embodiment of a poweramplification system 100 having a monitor and adapt system 1000 d.

FIGS. 14A to 14D show that in some embodiments, a power amplificationsystem can include features associated with one of the four exampleembodiments described herein.

For example, FIG. 14A shows that a power amplification system 100 caninclude a power amplifier 102 and a monitor and adapt system 110 thatincludes some or all of the features of the monitor and adapt system1000 a of the first example of FIG. 6 .

In another example, FIG. 14B shows that a power amplification system 100can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 b of the second example of FIG. 8 .

In yet another example, FIG. 14C shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 c of the third example of FIG. 9 .

In yet another example, FIG. 14D shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 d of the fourth example of FIG. 12 .

FIGS. 15A to 15F show that in some embodiments, a power amplificationsystem can include features associated with two of the four exampleembodiments described herein.

For example, FIG. 15A shows that a power amplification system 100 caninclude a power amplifier 102 and a monitor and adapt system 110 thatincludes some or all of the features of the monitor and adapt system1000 a of the first example of FIG. 6 , and some or all of the featuresof the monitor and adapt system 1000 b of the second example of FIG. 8 .

In another example, FIG. 15B shows that a power amplification system 100can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 a of the first example of FIG. 6 , and some or all of thefeatures of the monitor and adapt system 1000 c of the third example ofFIG. 9 .

In yet another example, FIG. 15C shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 a of the first example of FIG. 6 , and some or all of thefeatures of the monitor and adapt system 1000 d of the fourth example ofFIG. 12 .

In yet another example, FIG. 15D shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 b of the second example of FIG. 8 , and some or all of thefeatures of the monitor and adapt system 1000 c of the third example ofFIG. 9 .

In yet another example, FIG. 15E shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 b of the second example of FIG. 8 , and some or all of thefeatures of the monitor and adapt system 1000 d of the fourth example ofFIG. 12 .

In yet another example, FIG. 15D shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 c of the third example of FIG. 9 , and some or all of thefeatures of the monitor and adapt system 1000 d of the fourth example ofFIG. 12 .

FIGS. 16A to 16D show that in some embodiments, a power amplificationsystem can include features associated with three of the four exampleembodiments described herein.

For example, FIG. 16A shows that a power amplification system 100 caninclude a power amplifier 102 and a monitor and adapt system 110 thatincludes some or all of the features of the monitor and adapt system1000 a of the first example of FIG. 6 , some or all of the features ofthe monitor and adapt system 1000 b of the second example of FIG. 8 ,and some or all of the features of the monitor and adapt system 1000 cof the third example of FIG. 9 .

In another example, FIG. 16B shows that a power amplification system 100can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 a of the first example of FIG. 6 , some or all of thefeatures of the monitor and adapt system 1000 b of the second example ofFIG. 8 , and some or all of the features of the monitor and adapt system1000 d of the fourth example of FIG. 12 .

In yet another example, FIG. 16C shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 a of the first example of FIG. 6 , some or all of thefeatures of the monitor and adapt system 1000 c of the third example ofFIG. 9 , and some or all of the features of the monitor and adapt system1000 d of the fourth example of FIG. 12 .

In yet another example, FIG. 16D shows that a power amplification system100 can include a power amplifier 102 and a monitor and adapt system 110that includes some or all of the features of the monitor and adaptsystem 1000 b of the second example of FIG. 8 , some or all of thefeatures of the monitor and adapt system 1000 c of the third example ofFIG. 9 , and some or all of the features of the monitor and adapt system1000 d of the fourth example of FIG. 12 .

FIG. 17 show that in some embodiments, a power amplification system caninclude features associated with all of the four example embodimentsdescribed herein. More particularly, FIG. 17 shows that a poweramplification system 100 can include a power amplifier 102 and a monitorand adapt system 110 that includes some or all of the features of themonitor and adapt system 1000 a of the first example of FIG. 6 , some orall of the features of the monitor and adapt system 1000 b of the secondexample of FIG. 8 , some or all of the features of the monitor and adaptsystem 1000 c of the third example of FIG. 9 , and some or all of thefeatures of the monitor and adapt system 1000 d of the fourth example ofFIG. 12 .

Examples of System Implementations:

In some embodiments, a power amplification system having one or morefeatures as described herein can be implemented in different productsand/or in different locations. FIGS. 18 and 19 show examples of systemimplementations where a semiconductor die can include some or all of apower amplification system. FIGS. 20 to 22 show examples of systemimplementations where an RF module can include some or all of a poweramplification system. FIGS. 23 to 27 show examples where a poweramplification system is a part of a wireless system.

FIG. 18 shows that in some embodiments, a semiconductor die 200 having asubstrate 202 can include a power amplification system 100. Such a poweramplification system can include a power amplifier 102 and a monitor andadapt system 110 having one or more features as described herein.

FIG. 19 shows that in some embodiments, a semiconductor die 210 having asubstrate 202 can include some of a power amplification system 100. Sucha power amplification system can include a power amplifier 102implemented on the semiconductor die 210, and a monitor and adapt system110 having one portion implemented on the semiconductor die 210, andanother portion implemented outside of the semiconductor die 210. Forexample, a monitor circuit 112 having one or more features as describedherein can be implemented on the semiconductor die 210, and a DPD system114 having one or more features as described herein can be implementedoutside of the semiconductor die 210.

FIG. 20 shows that in some embodiments, an RF module 300 having apackaging substrate 302 can include die 200 mounted thereon and having apower amplification system 100, similar to the die 200 of FIG. 18 . Sucha power amplification system can include a power amplifier 102 and amonitor and adapt system 110 having one or more features as describedherein.

FIG. 21 shows that in some embodiments, an RF module 310 having apackaging substrate 312 can include a first die 201 having a poweramplifier 102 implemented thereon, a second die 202 having a monitorcircuit 112 implemented thereon, and a third die 203 having a DPD system114 implemented thereon. In such a configuration, the RF module 310 caninclude substantially all of a power amplification system 100implemented on a plurality of die.

FIG. 22 shows that in some embodiments, an RF module 320 having apackaging substrate 322 can include a first die 201 having a poweramplifier 102 implemented thereon, and a second die 202 having a monitorcircuit 112 implemented thereon. A DPD system 114 is shown to beimplemented outside of the RF module 320. In such a configuration, theRF module 320 can include a portion of a power amplification system 100implemented on one or more die (e.g., the PA 102 and the monitor circuit112), and the other portion (e.g., the DPD system 114) of theamplification system 100 can be implemented away from the RF module 320.

FIG. 23 shows a block diagram of a wireless system 400 that includes apower amplification system having one or more features as describedherein. The power amplification system can include a power amplifier102, and such a power amplifier can be in communication with atransceiver 402, and receive from the transceiver 402 an RF signal to beamplified and transmitted through an antenna 104. The transceiver 402can be in communication with a baseband sub-system 404 that isconfigured to process digital signals. In some embodiments, the basebandsub-system 404 can include at least a portion of a DPD system having oneor more features as described herein, and such a DPD system can be apart of the power amplification system.

In the example of FIG. 23 , a monitor and adapt system 110 having one ormore features as described herein can be a part of the foregoing poweramplification system. The monitor and adapt system 110 can include amonitor system 112 and an adapt system 114. In some embodiments, themonitor and adapt system 110 can also include a processor 410 configuredto support either or both of the monitor system 112 and the adapt system114.

In the example of FIG. 23 , the wireless system 400 is shown to furtherinclude a power source 406 configured to power some or all of thevarious parts of the wireless system 400.

FIG. 24 shows that in some embodiments, substantially all of thewireless system 400 of FIG. 23 can be implemented within a base station500 such as a cellular base station. In such a configuration, the powersource 406 can include, for example, an AC source and a converter thatoutputs one or more appropriate voltages and/or currents for theoperation of the wireless system 400.

In the example of FIG. 24 , the processor 410 can be located andoperated within the base station 500. For example, the processor 410 canbe located and operated within the same building, within the same room,within the same equipment rack, on the same circuit board, and/or withinthe same enclosure as the other parts of the wireless system 400.

FIG. 25 shows that in some embodiments, substantially all of thewireless system 400 of FIG. 23 can be implemented within a mobile device502. In such a configuration, the power source 406 can include, forexample, a rechargeable or non-rechargeable battery that powers theoperation of the wireless system 400.

In the example of FIG. 25 , the processor 410 can be located andoperated within the mobile device 502. For example, the processor 410can be located and operated within the same case, and/or within the samecircuit as the other parts of the wireless system 400.

FIG. 26 shows that in some embodiments, a portion of the wireless system400 of FIG. 23 can be implemented within a base station 500 such as acellular base station, and another portion of the wireless system 400can be implemented away from the base station 500. For example, a remotecomputing device 410 can be implemented and operated away from the basestation 500; and such a computing device can communicate (e.g.,wirelessly and/or through a cable) with the portion of the wirelesssystem 400 within the base station 500.

FIG. 27 shows that in some embodiments, a portion of the wireless system400 of FIG. 23 can be implemented within a mobile device 502, andanother portion of the wireless system 400 can be implemented away fromthe mobile device 502. For example, a remote computing device 410 can beimplemented and operated away from the mobile device 502; and such acomputing device can communicate (e.g., wirelessly and/or through acable) with the portion of the wireless system 400 within the mobiledevice 502.

It is noted that in some embodiments, the remote computing device 410 ofFIGS. 26 and 27 can provide an increased computing capability tosupport, for example, AI and/or neural network computations beingconducted over a “cloud computing internet-based” system, for some orall of the monitor and adapt systems described herein.

The present disclosure describes various features, no single one ofwhich is solely responsible for the benefits described herein. It willbe understood that various features described herein may be combined,modified, or omitted, as would be apparent to one of ordinary skill.Other combinations and sub-combinations than those specificallydescribed herein will be apparent to one of ordinary skill, and areintended to form a part of this disclosure. Various methods aredescribed herein in connection with various flowchart steps and/orphases. It will be understood that in many cases, certain steps and/orphases may be combined together such that multiple steps and/or phasesshown in the flowcharts can be performed as a single step and/or phase.Also, certain steps and/or phases can be broken into additionalsub-components to be performed separately. In some instances, the orderof the steps and/or phases can be rearranged and certain steps and/orphases may be omitted entirely. Also, the methods described herein areto be understood to be open-ended, such that additional steps and/orphases to those shown and described herein can also be performed.

Some aspects of the systems and methods described herein canadvantageously be implemented using, for example, computer software,hardware, firmware, or any combination of computer software, hardware,and firmware. Computer software can comprise computer executable codestored in a computer readable medium (e.g., non-transitory computerreadable medium) that, when executed, performs the functions describedherein. In some embodiments, computer-executable code is executed by oneor more general purpose computer processors. A skilled artisan willappreciate, in light of this disclosure, that any feature or functionthat can be implemented using software to be executed on a generalpurpose computer can also be implemented using a different combinationof hardware, software, or firmware. For example, such a module can beimplemented completely in hardware using a combination of integratedcircuits. Alternatively or additionally, such a feature or function canbe implemented completely or partially using specialized computersdesigned to perform the particular functions described herein ratherthan by general purpose computers.

Multiple distributed computing devices can be substituted for any onecomputing device described herein. In such distributed embodiments, thefunctions of the one computing device are distributed (e.g., over anetwork) such that some functions are performed on each of thedistributed computing devices.

Some embodiments may be described with reference to equations,algorithms, and/or flowchart illustrations. These methods may beimplemented using computer program instructions executable on one ormore computers. These methods may also be implemented as computerprogram products either separately, or as a component of an apparatus orsystem. In this regard, each equation, algorithm, block, or step of aflowchart, and combinations thereof, may be implemented by hardware,firmware, and/or software including one or more computer programinstructions embodied in computer-readable program code logic. As willbe appreciated, any such computer program instructions may be loadedonto one or more computers, including without limitation a generalpurpose computer or special purpose computer, or other programmableprocessing apparatus to produce a machine, such that the computerprogram instructions which execute on the computer(s) or otherprogrammable processing device(s) implement the functions specified inthe equations, algorithms, and/or flowcharts. It will also be understoodthat each equation, algorithm, and/or block in flowchart illustrations,and combinations thereof, may be implemented by special purposehardware-based computer systems which perform the specified functions orsteps, or combinations of special purpose hardware and computer-readableprogram code logic means.

Furthermore, computer program instructions, such as embodied incomputer-readable program code logic, may also be stored in a computerreadable memory (e.g., a non-transitory computer readable medium) thatcan direct one or more computers or other programmable processingdevices to function in a particular manner, such that the instructionsstored in the computer-readable memory implement the function(s)specified in the block(s) of the flowchart(s). The computer programinstructions may also be loaded onto one or more computers or otherprogrammable computing devices to cause a series of operational steps tobe performed on the one or more computers or other programmablecomputing devices to produce a computer-implemented process such thatthe instructions which execute on the computer or other programmableprocessing apparatus provide steps for implementing the functionsspecified in the equation(s), algorithm(s), and/or block(s) of theflowchart(s).

Some or all of the methods and tasks described herein may be performedand fully automated by a computer system. The computer system may, insome cases, include multiple distinct computers or computing devices(e.g., physical servers, workstations, storage arrays, etc.) thatcommunicate and interoperate over a network to perform the describedfunctions. Each such computing device typically includes a processor (ormultiple processors) that executes program instructions or modulesstored in a memory or other non-transitory computer-readable storagemedium or device. The various functions disclosed herein may be embodiedin such program instructions, although some or all of the disclosedfunctions may alternatively be implemented in application-specificcircuitry (e.g., ASICs or FPGAs) of the computer system. Where thecomputer system includes multiple computing devices, these devices may,but need not, be co-located. The results of the disclosed methods andtasks may be persistently stored by transforming physical storagedevices, such as solid state memory chips and/or magnetic disks, into adifferent state.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list. The word “exemplary” is usedexclusively herein to mean “serving as an example, instance, orillustration.” Any implementation described herein as “exemplary” is notnecessarily to be construed as preferred or advantageous over otherimplementations.

The disclosure is not intended to be limited to the implementationsshown herein. Various modifications to the implementations described inthis disclosure may be readily apparent to those skilled in the art, andthe generic principles defined herein may be applied to otherimplementations without departing from the spirit or scope of thisdisclosure. The teachings of the invention provided herein can beapplied to other methods and systems, and are not limited to the methodsand systems described above, and elements and acts of the variousembodiments described above can be combined to provide furtherembodiments. Accordingly, the novel methods and systems described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the methods andsystems described herein may be made without departing from the spiritof the disclosure. The accompanying claims and their equivalents areintended to cover such forms or modifications as would fall within thescope and spirit of the disclosure.

1. A power amplification system comprising: a power amplifier configuredto receive an input signal and provide an amplified signal; a couplerimplemented relative to an output of the power amplifier and configuredto measure forward power and reverse power at the output of the poweramplifier; and a controller configured to receive informationrepresentative of the measured forward power and reverse power, andbased on the information, generate a control signal for adjusting aparameter associated with the power amplifier.
 2. The poweramplification system of claim 1 wherein the control signal includes asignal for providing digital predistortion to a digital signalcorresponding to the input signal provided to the power amplifier. 3.The power amplification system of claim 1 wherein the controllerincludes either or both of an artificial intelligence capability and aneural network capability.
 4. The power amplification system of claim 3wherein the controller includes a processor configured to provide eitheror both of the artificial intelligence capability and the neural networkcapability.
 5. The power amplification system of claim 4 wherein both ofthe processor and the power amplifier are implemented within samelocation or device.
 6. The power amplification system of claim 4 whereinthe processor and the power amplifier are implemented at differentlocations or devices.
 7. The power amplification system of claim 3wherein the controller is configured to determine a voltage standingwave ratio based on the measured forward power and reverse power.
 8. Thepower amplification system of claim 7 wherein the control signalincludes a signal for adjusting a bias being provided to the poweramplifier based on the voltage standing wave ratio.
 9. The poweramplification system of claim 7 wherein the power amplifier includes anamplifying transistor having a gate, a source, and a drain, such thatthe gate is an input for receiving the input signal and the drain isconnected to the output of the power amplifier.
 10. The poweramplification system of claim 9 wherein the control signal includes asignal for adjusting either or both of gate-source voltage and supplyvoltage to compensate for a load mismatch based on the voltage standingwave ratio.
 11. The power amplification system of claim 9 wherein theamplifying transistor is implemented as a gallium nitride (GaN)transistor.
 12. The power amplification system of claim 1 wherein thecoupler is configured to include four ports corresponding to a firstport coupled to the output of the power amplifier, a second port coupledto an antenna node, a third port for forward power measurement, and afourth port for reverse power measurement.
 13. The power amplificationsystem of claim 12 wherein the third port and the fourth port arecoupled to or capable of being coupled to the controller.
 14. A methodfor operating a power amplification system, the method comprising:providing an input signal to a power amplifier; amplifying the inputsignal with the power amplifier to generate an amplified signal;measuring forward power and reverse power at an output of the poweramplifier; and generating a control signal based on the measured forwardpower and reverse power for adjusting a parameter associated with thepower amplifier.
 15. The method of claim 14 further comprisingperforming a digital predistortion operation to a digital signalcorresponding to the input signal provided to the power amplifier basedon the control signal.
 16. The method of claim 15 wherein the generatingof the control signal includes either or both of an artificialintelligence operation and a neural network operation.
 17. The method ofclaim 16 wherein the generating of the control signal includesdetermining a voltage standing wave ratio based on the measured forwardpower and reverse power.
 18. The method of claim 17 wherein thegenerating of the control signal further includes providing a signal foradjusting a bias being provided to the power amplifier based on thevoltage standing wave ratio.
 19. The method of claim 17 wherein thegenerating of the control signal further includes providing a signal foradjusting either or both of gate-source voltage and supply voltage tocompensate for a load mismatch based on the voltage standing wave ratio.20. A wireless system comprising: a baseband sub-system configured toprocess a digital signal to be transmitted; a power amplifier configuredto receive an analog signal representative of the digital signal andprovide an amplified signal; an antenna in communication with an outputof the power amplifier and configured to support transmission of theamplified signal; and a monitor and adapt system implemented to measureforward power and reverse power at the output of the power amplifier,and to generate a control signal for adjusting a parameter associatedwith the power amplifier based on the measured forward power and reversepower.
 21. (canceled)
 22. (canceled)
 23. (canceled)
 24. (canceled) 25.(canceled)